Sorry 'bout that, my sarcasm didnt come thru the keyboard that time.
I thought it was damn funny myself when first I saw those pictures.. It's Toast...
But the more I look at that area on my LMM board, there isn't much to get smoked on top or bottom. Might just be charbroil on the surface. But these look to be 4 layer minimum. No light gets thru, so probably something critical traces thru that zone we can't see. But my goal for that crispy critter is to just compare the chips, and read the mem to better understand why we can't write an E35A OS onto a E35B board. There is a Bosch and GM # designation difference that I recall posting about a couple dozen pages back. But on the surface, they look identical, and I've yet to source matching schematic for either.
As for our FUCM upgrades, think we can all see what parts of the early Bosch driver circuit really needs some attention. There lye 7 years of Bosch CDI technology behind those crispy caps. Going with Lead Free solder in EU back then? Seeing a trend here.. Whatever the cause, we need to go crazy overkill on the High Voltage PCB attachment points. It's obviously a Time related failure, and I'd prefer these new boards outlast me...